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PRIME 2016 and SMACD 2016 Registration

The registration is now open. The full registration covers the publication of 2 papers, access to PRIME and SMACD conference first day tutorials/workshops, technical sessions, proceedings of both conferences and Company Fair, coffee breaks, lunches, welcome reception and conference dinner. The Workshop/Tutorials registration only includes admission to the workshop/tutorials on 27th June 2016 along with coffee and lunch.

PRIME 2016 and SMACD 2016 Panels

Panel sessions will be organized during the conference with the participation of speakers from both academia and industry, and from design and EDA communities.

PRIME 2016 Paper Submissions

The PRIME 2016 Conference will accept only electronic submission of the paper(s) in PDF format. The maximum number of pages that will be accepted is 4, including all figures, tables, and references. Authors should prepare the manuscript according to the IEEE double column conference paper template style.

PRIME 2016 and SMACD 2016 Paper Publication

The conference is technically co-sponsored by IEEE and IEEE CAS. The accepted papers will be published at IEEExplore.

IEEE CASS Scholarship

The IEEE CAS society will grant 12 student registrations for PRIME 2016. In order to apply, to this IEEE CASS support, candidates must be enrolled in a PhD program related to the fields of interest of CASS, be an IEEE Student member and have a paper accepted and selected for presentation at PRIME.

PRIME 2016 and SMACD 2016 Plenary Speakers

Prof. Geoges Gielen
Katholieke Universiteit Leuven, Belgium
Prof. Maysam Ghovanloo
Georgia Institute of Technology, USA
Prof. Pui-In Mak
University of Macau, China

PRIME 2016 and SMACD 2016 Special Issue

The top ranked papers in both conferences PRIME and SMACD 2016 will be invited to submit extended versions for a Special Issue of Integration, The VLSI Journal (Elsevier).

PRIME 2016 Best Paper Awards

Based on the reviewer’s and the awards-committee's evaluation top 30% papers will be awarded as follows:

  • The GOLD LEAF Certificate for the top 10% papers.
  • The SILVER LEAF Certificate for papers between top 10% and top 20%.
  • The BRONZE LEAF Certificate for papers between top 20% and top 30%.

12th Conference on PhD Research in Microelectronics and Electronics (PRIME 2016) will be held from the 27th to the 30th of June 2016 in Lisbon, Portugal at the IST Congress Center. PRIME2016 conference program will reflect the wide spectrum of research topics in Microelectronics and Electronics, building bridges between various research fields. In addition to the technical sessions, opportunities for the conference attendees will be the keynote talks, workshops and social events. PRIME 2016 is Technically Co-sponsored by IEEE and IEEE CAS. All accepted papers will be published in IEEE Xplore.

PRIME has been established over the recent years as an important conference where PhD students and post-docs with less than one year post-PhD experience can present their research results and network with experts from industry, academia and research.

The main objectives of PRIME are:

  • to encourage favourable exposure to Ph.D. students in the early stages of their careers,
  • to benchmark Ph.D. research in a friendly and cooperative environment,
  • to enable sharing of student and supervisor experiences of scientific and engineering research,
  • to connect Ph.D. students and their supervisors with companies and research centres.

Important dates

4th March 2016
Paper Submission Deadline
18th March 2016
Extended Paper Submission Deadline
15th April 2016
Author Notification
30th April 2016
Author Notification
30th April 2016
Camera Ready Paper Submission
15th May 2016
Camera Ready Paper Submission
30th April 2016
Early Registration Deadline
15 22nd May 2016
Early Registration Deadline

Areas of interest:

PRIME 2016 areas of interest are listed below. Other topics within electronics field will also be considered.

  • Micro/Nanoelectronics
  • Semiconductors
  • Analog/Digital Signal Processing
  • Computer Aided Design
  • Analog/Digital/Mixed/RF IC Design
  • Integrated Power ICs
  • Sensors/Systems and MEMS
  • RF, Microwave and mm-wave Circuits
  • VLSI and SoC Applications
  • Visual Signal Processing
  • Energy Scavenging
  • Technical Trends & Challenges
  • Electronic Skin
  • Flexible Electronics